IPC releases a new document.

IPC New Release: IPC-4552A

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

 

The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use bychemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.

 

The IPC-4552A specification is based on three critical factors:

  1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
  2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
  3. That the ENIG plating process results in uniform deposit characteristics.

 

If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined.

 

148 pages. Released August 2017.

Preview the table of contents .pdf file.

Hard copy:

Member Price: $80.00

Industry Price: $160.00

Author: CBH Solutions LLC

IPC Certified Master Trainer IPC Certified Trainer, IPC A 610, JSTD-001, JSTD-001 Space, IPC WHMA 620, IPC 7711/7721 ESDA/IPC Certified ESD Trainer

One thought on “IPC releases a new document.”

  1. Thank you so much CBH Solutions for giving updates time to time… I appreciate your concern for spreading knowledge around the world.
    Scope of IPC-4552A: This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).

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